| Product Description 3D Printer parts Heated Bed/Extruder Power Module Exceed Max Current 25A/30A MKS MOSFET for RAMPS 1.4 Heating-Controller
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Features:
Style 1:
Heated bed power module
Based on powerful MOSFET HA210NO6
Size: 60*50mm
Mounting holes: 3.2mm diameter, for M3 screws.
Distance betweeen holes: 54*43mm
Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle
Voltage: 12V-24V
Under the premise of normal cooling, it work stable under I(Max)=25A, the current must not exceed 25A while the process working
Style 2:
Size: 70*45mm
Mounting holes: 3.2mm diameter, for M3 screws.
Distance betweeen holes: 62.8*37.8mm
Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle
Voltage: 12V-50V
Maximum current with active cooling: 210A
This module is based on power MOSFET and will allow PID control of the heated bed (DC-DC Relays usually do not allow this)
Under the premise of normal cooling, it work stable under I(Max)=30A, the current must not exceed 25A while the process working
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. Brand Name:MellowItem Type:High Power ModuleModel Number:118Product name:MOS moduleMOSFET Transistor:semiconductor deviceBoard Size:60mm*50mm/70mm*45mmVoltage:12-24VCurrent:25A/30A |
